Pixel 11 Pro Fold Surfaces at the FCC, Confirming Display Specs and a Historic Modem Switch

Google’s next foldable has made its way through federal certification.

A device carrying model number GZDQ6, widely believed to be the Pixel 11 Pro Fold, appeared in the FCC’s database this week, confirming key connectivity details ahead of the phone’s expected August 12 debut alongside the rest of the Pixel 11 lineup.

What the FCC Filing Confirms

As Android Authority notes, the certification documents confirm that the foldable supports Bluetooth LE, LTE, Ultra-wideband, NFC, and Thread connectivity, and that the device will be hearing aid compatible. 

Leaks circulating alongside the filing point to a 1,080 x 2,342 OLED outer display running at 60-120Hz, paired with a larger 2,076 x 2,160 OLED inner panel capable of scaling down to 1Hz.

These specific aspect ratios align perfectly with design aesthetics uncovered back in late April, when Pixel 11 Pro Fold stock wallpapers were found.  

Rumors also suggest a minimum battery capacity of 4,658mAh and two RAM configurations, 12GB and 16GB, giving buyers a choice similar to what Samsung offers on its own foldable lineup, revealed in the recent price leaks.

A Modem Detail Buried in the Paperwork

The more consequential discovery sits inside the filing’s SAR test report, the section measuring radio frequency exposure from the device. 

That report references the MediaTek TA-SAR v2 algorithm, adding real evidence to rumors dating back to last fall that Google is dropping Samsung’s Exynos modem for a MediaTek chip on the Tensor G6. 

Every Tensor processor to date has paired with a Samsung-made modem, so a switch would mark the first time a Pixel phone ships without one. 

The modem in question is widely expected to be the MediaTek M90, a chip supporting dual 5G SIM dual-active functionality and downlink speeds up to 12Gbps, alongside AI-driven power management MediaTek claims can meaningfully cut consumption.

Why the Chip Change Matters This Time

Pixel phones have long lagged behind Samsung flagships on cellular reception and modem efficiency, an issue Google’s TSMC-built Tensor G5 didn’t fully resolve last year. 

The Tensor G6, reportedly built on TSMC’s 2nm process with Gate-All-Around transistor architecture and a seven-core layout, is expected to pair with the new MediaTek modem to address power drain from two directions at once rather than just the processor alone. 

Google has not confirmed any of these specifications directly, and the company is expected to detail the Tensor G6 formally when it unveils the Pixel 11 series in New York on August 12. 

With the FCC filing now public, expect additional teardown details and benchmark leaks to surface as the launch date approaches.

Source: Pixel 11 Pro Fold FCC listing adds support for a big Tensor G6 shake-up